The “Soft Side” of Chips Takes Center Stage in Microelectronics
In today’s high‑performance microelectronics industry, where attention often focuses on process ...
Mature‑Node Foundries Face Price Pressure Amid Capacity Expansion and Sub‑5nm Focus
The landscape of semiconductor manufacturing is undergoing a marked shift as foundries increasingly ...
STMicroelectronics’ $60 Million Pilot for Panel‑Level Packaging
With wafer‑forging once again showing signs of life, the broader silicon substrate market is gaini...
U.S. National Institute of Standards and Technology Opens Major Funding Opportunity to Advance Microelectronics R&D
On September 24, 2025, the National Institute of Standards and Technology (NIST) announced a Bro...
GlobalFoundries Commits $16 Billion to U.S. Expansion: What It Means for Microelectronics
In June 2025, GlobalFoundries (GF) unveiled an ambitious plan to invest $16 billion in its U.S. op...
U.S. NIST Launches CHIPS R&D BAA: What It Means for Microelectronics Innovation in 2025
On September 24, 2025, the National Institute of Standards and Technology (NIST) released a Broa...
The Next Frontier of Semiconductor Materials with CSiGeSn Alloys
In mid‑2025, a team of researchers at Forschungszentrum Jülich and the Leibniz Institute for Inno...
Integrating 2D Materials onto Traditional CMOS for Ultra‑Low Power Memory
The microelectronics industry has reached a fascinating inflection point. With transistor scaling li...
Battery Management ICs & Power Efficiency
Driven by surging demand in portable electronics, electric vehicles, and energy storage systems, the...
Advances in Microelectronics Packaging
Advanced microelectronics packaging has become a strategic driver of performance, scalability, and i...