On September 24, 2025, the National Institute of Standards and Technology (NIST) announced a Broad Agency Announcement (BAA) inviting proposals for research, prototyping, and commercial solutions aimed at strengthening U.S. leadership in microelectronics. Under the umbrella of the CHIPS and Science Act, the funding effort is managed by the CHIPS Research and Development Office (CRDO) and aligns with national security, economic competitiveness, and emerging‑technology goals.
The announcement states that eligible applicants—covering for‑profit enterprises, nonprofit organizations, academic institutions, federally‑funded research centers, and federal entities—may submit white papers at any time via Grants.gov. Project budgets are expected to start at approximately $10 million, although actual awards will depend on merit and available appropriations.
Among the priority technical areas identified are advanced semiconductor technologies, artificial‑intelligence‑enabled microelectronics, quantum and biomanufacturing integration, commercialization pathways, and standards development.
The timing of this opportunity is significant. With rapid growth in AI, edge computing, automotive electronics, and defense systems placing unprecedented demands on microcomponents, the BAA provides a strategic tool for companies and institutions to align their R&D efforts with federal priorities. For microelectronics firms, this represents a clear signal that innovation must increasingly converge toward system‑level integration, supply‑chain resiliency, and domestic production.
Importantly, the BAA mandates that research efforts not only push technical frontiers but also demonstrate pathways to commercialization. The CRDO framework emphasizes “technology dominance in the industries of the future,” demanding that proposals include considerations of scale‑up, intellectual property flow, and economic impact. In addition, compliance clauses may require awardees to grant licenses, equity, or royalty arrangements to reflect return on investment to the U.S. Government.
From a strategic sourcing perspective, component buyers, system integrators, and fabrication service providers should view this announcement as more than a funding opportunity—it represents a roadmap of where federal policy and capital are steering. Proposals targeting emerging packaging, heterogeneous‑integration, trusted supply‑chains, or workforce development will benefit from alignment with these themes.
For the semiconductor supply chain, this BAA may well catalyze the next wave of materials innovation, advanced packaging, heterogeneous integration of chips and sensors, and design‑for‑security architectures. Firms preparing white‑papers now will position themselves not only for potential award flows but also for visibility within the federal ecosystem—a factor that may enhance partnerships, credibility, and future contract eligibility.
In sum, the NIST BAA issued under the CHIPS effort signals a paradigm shift: microelectronics research is no longer just a matter of process‑node advancement—it is firmly embedded in national strategy. For participants throughout the microelectronics value chain, understanding the opportunity, aligning capabilities, and moving early could make the difference between keeping pace and leading the next decade of innovation.