Why Polymer and Substrate Innovation Is Now Critical for 3D/2.5D Chips
In 2025, the materials that surround and support microelectronic dies — once considered passive af...
How Advanced Semiconductor Packaging Is Becoming the New Bottleneck & Opportunity
In 2025, an unmistakable shift is gathering momentum in the microelectronics industry: packaging is ...
Silicon Wafer Shipment Q3 2025 Surge and What It Means for Microelectronics Supply Chains
According to the latest report from SEMI — the global industry trade association — worldwide sil...
Ten Fab and Packaging Projects Signal a Strategic Shift in Microelectronics
In recent weeks, India has accelerated its bid to become a global microelectronics manufacturing hub...
The “Soft Side” of Chips Takes Center Stage in Microelectronics
In today’s high‑performance microelectronics industry, where attention often focuses on process ...
Mature‑Node Foundries Face Price Pressure Amid Capacity Expansion and Sub‑5nm Focus
The landscape of semiconductor manufacturing is undergoing a marked shift as foundries increasingly ...
STMicroelectronics’ $60 Million Pilot for Panel‑Level Packaging
With wafer‑forging once again showing signs of life, the broader silicon substrate market is gaini...
U.S. National Institute of Standards and Technology Opens Major Funding Opportunity to Advance Microelectronics R&D
On September 24, 2025, the National Institute of Standards and Technology (NIST) announced a Bro...
GlobalFoundries Commits $16 Billion to U.S. Expansion: What It Means for Microelectronics
In June 2025, GlobalFoundries (GF) unveiled an ambitious plan to invest $16 billion in its U.S. op...
U.S. NIST Launches CHIPS R&D BAA: What It Means for Microelectronics Innovation in 2025
On September 24, 2025, the National Institute of Standards and Technology (NIST) released a Broa...