The Defense Advanced Research Projects Agency (DARPA) has been proactively addressing the long-term challenges in the microelectronics sector. Over the past 30 years, the United States’ share in global microchip production has significantly decreased, from 37% to around 12%, with countries like Taiwan and China taking the lead in advanced semiconductor production and export. This shift has created dependencies on overseas supply chains for critical components used in everything from consumer electronics to advanced military systems like the F-35 fighter aircraft.
DARPA’s approach to tackling these challenges is rooted in its heritage of microelectronics research, dating back to initiatives like the Metal Oxide Silicon Implementation Service in the 1980s. Recognizing the urgency of the situation, especially following a 2017 report by the President’s Council of Advisors on Science and Technology, DARPA has been formulating plans to overcome technological barriers in semiconductor innovation.
One of DARPA’s significant efforts is the Electronics Resurgence Initiative (ERI), launched in 2017. This initiative, with an investment of over $1.5 billion over five years, focuses on key technological barriers facing both the commercial industry and national security agencies in microelectronics research, development, and manufacturing. Following its success, DARPA launched ERI 2.0 with a continued emphasis on advanced manufacturing and technologies for operating electronic systems in extreme environments. An additional $3 billion is planned to be invested in these efforts over the next five years.
These initiatives are aimed at developing disruptive technologies that are expected to keep U.S. manufacturing capabilities ahead of global competitors. DARPA’s role complements the efforts of other federal agencies like the Department of Commerce and the Department of Energy, which focus on investing in foundries and supporting U.S. research in more established areas of microelectronics.
Additionally, the passage of the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act by Congress has further spurred efforts in this field. The CHIPS Act, with a $52 billion fund, aims to support semiconductor workforce improvement, research, development, and manufacturing, along with a 25% tax credit for domestic manufacturing facilities and equipment.
DARPA’s involvement in microelectronics extends beyond funding. It includes collaborations with the Department of Defense, the National Semiconductor Technology Center, and various industry partners. These collaborations are crucial for ERI and ERI 2.0, which address technological hurdles impacting both the national security community and the broader commercial industry.
Overall, DARPA’s proactive and forward-thinking approach, coupled with significant investment and collaboration, is crucial in addressing the long-term challenges in the microelectronics industry, a sector vital for both national security and economic competitiveness.