The Department of Defense (DoD) has initiated an ambitious project, the Microelectronics Commons FY24 Call for Projects, with an allocation of up to $280 million. This significant investment aims to support the domestic prototyping and fabrication of microelectronics, which is crucial for enhancing the technological prowess of the United States military. This initiative is aligned with the objectives of the CHIPS and Science Act and President Biden’s Investing in America agenda.
The Microelectronics Commons initiative stands as a strategic move to bolster America’s position in the realm of high-tech microelectronics, an area essential for the country’s defense and economic competitiveness. Dr. David Honey, Deputy Under Secretary of Defense for Research and Engineering, emphasized the importance of bridging the gap from laboratory research to fabrication, acknowledging the challenges in transitioning microelectronics designs to large-scale production.
The focus areas of this funding are diverse and cover cutting-edge fields in technology. These include Secure Edge/Internet of Things (IoT) Computing, 5G/6G Technology, Artificial Intelligence Hardware, Quantum Technology, Electromagnetic Warfare, and Commercial Leap Ahead Technologies. The overarching goal is to ensure a sustainable pipeline of world-leading microelectronics produced domestically, which is vital for the U.S. defense industrial base.
The project also aims to empower U.S. businesses and universities, allowing them to demonstrate their microelectronics innovations at scale for both DoD and commercial uses. The initiative encompasses eight regional innovation hubs, announced by Deputy Secretary of Defense Kathleen Hicks, which are responsible for evolving laboratory prototypes into fabrication prototypes and augmenting the semiconductor workforce. These hubs span 35 states, the District of Columbia, and Puerto Rico and include over 380 organizations, more than 100 of which are academic institutions.
The DoD anticipates that the project awards under the Microelectronics Commons will be issued in the third quarter of fiscal year 2024, marking a significant milestone in the United States’ journey towards microelectronics innovation and self-reliance